| 摘要 |
The invention relates to a method for producing a plurality of optoelectronic semiconductor components (100) comprising the following steps: a) providing an auxiliary carrier (2); b) providing a plurality of semiconductor chips (6), wherein each of the semiconductor chips has a carrier body (10) and a semiconductor body (16) arranged on an upper side (12) of the carrier body; c) attaching the plurality of semiconductor chips (6) to the auxiliary carrier (2), wherein the semiconductor chips (6) are spaced apart in a lateral direction (L) and wherein the semiconductor bodies (16) are facing away from the carrier body (10) as seen from the auxiliary carrier (2); d) forming a housing body composite (28) at least in regions between the carrier bodies (10) of adjacent semiconductor chips (6), wherein the semiconductor chips are completely formed e) removing the auxiliary carrier (2); f) reducing the housing composite (28); and g) individually separating the housing composite (28) into a plurality of optoelectronic semiconductor components (100), each semiconductor component comprising at least one semiconductor chip (6) and one part of the housing body composite as a housing body. |
