THERMOCOMPRESSION ADHESIVE FOR ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce the coefficient of linear expansion and prevent the generation of bubbles on heat curing of a resin mixture by adding an inorganic filler. SOLUTION: The titled adhesive comprises (A) from 30 to 80 wt.% thermosetting resin, (B) from 20 to 70 wt.% inorganic filler and (C) from 0.01 to 1 wt.% organoalkoxysilane such as methyl trimethoxysilane (boiling point l02 deg.C) against the total weight of the resin composition. Here, (B) the inorganic filler is previously added with (C) the organoalkoxysilane and heated at a temperature equal to or above the boiling point to modify the surface of the filler powder.