| 摘要 |
A low profile, heat transfer, electronic component cooling fan is disclosed. The heat transfer body (20) includes a pressure differential surface (34) formed around the outer perimeter of the fan blades (30) within a first segment of the axial blade depth region. An interface surface (38) for connection to the electronic component is positioned opposite of the fan frame (25). Some heat transfer devices (45) are disposed between the frame (25) and the interface surface (38), such that the heat transfer devices (45) are positioned within a second segment of the axial blade depth region. |
