| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emission element that can be enhanced in reliability.SOLUTION: A light emission element 10 is a flip-chip type light emission diode in which an n-type layer, a light emission layer and p-type layer are laminated on the lamination surface of a rectangular substrate 11. In the light emission element 10, a high position face and a low position face are formed on a top surface 111 at the opposite side to the lamination surface. A step portion between the high position face and the low position face is located at a corner edge portion 113 of the top surface 111. The step portion is based on the low position face at which the top surface 111 of the substrate 11 is etched and becomes a fine uneven face in an etching step, and the high position face which is not etched and thus remains because a defective concentration area having a high crystal defect density is located at the corner edge portion. Since the step portion is located at the corner edge portion 113 of the substrate 11, even when the light emission element is adsorbed by a collet, the step portion can be avoided from coming into contact with the collet, and thus occurrence of crack or chip at the step portion can be prevented.SELECTED DRAWING: Figure 1 |
