METHOD AND APPARATUS FOR ETCHING LASER MARKED DISK-LIKE MEMBER

摘要

PROBLEM TO BE SOLVED: To provide a method and an apparatus for etching which can solve the problems such as sags/recesses, etc. generated around the dots of a laser marked wafer in an etching step of manufacturing the wafer. SOLUTION: The method for etching includes a step of etching the laser marked wafer 30 by rotating in an etching tank 12 in which an etchant is fully filled. The method further includes a step of etching the wafer 30 while rocking the wafer 30 to the liquid surface of the etchant so that a part or all of the wafer 30 moves out of the liquid surface of the etchant. Moreover, the apparatus for etching supports and rotates the wafer 30 in the etchant and etches the wafer 30 while rocking the wafer 30 to the liquid surface of the etchant so that the part or all of the wafer 30 moves out of the liquid surface of the etchant. COPYRIGHT: (C)2005,JPO&NCIPI