| 发明名称 | Wiring substrate and multi-piece wiring substrate | ||
| 摘要 | A wiring substrate includes: a substrate body made of ceramic and having a front surface and a rear surface, each having a rectangular shape in a plan view, a plurality of rear surface electrodes formed on the rear surface of the substrate body, a frame-shaped conductive portion provided on the front surface side of the substrate body, and a via conductor penetrating the substrate body and establishing electric connection between the plurality of rear surface electrodes and the frame-shaped conductive portion. A part of the rear surface is exposed between the plurality of rear surface electrodes and each side of the rear surface of the substrate body. On the rear surface of the substrate body, at least one projecting wiring is formed between each of the plurality of rear surface electrodes and each of a corresponding pair of the sides that intersect with each other. | ||
| 申请公布号 | US9491867(B2) | 申请公布日期 | 2016.11.08 |
| 申请号 | US201514868547 | 申请日期 | 2015.09.29 |
| 申请人 | NGK SPARK PLUG CO., LTD. | 发明人 | Kurauchi Takashi;Yoshida Yoshitaka;Akita Kazushige |
| 分类号 | H05K7/00;H05K1/11;H05K3/24;H05K3/00;H03H9/10 | 主分类号 | H05K7/00 |
| 代理机构 | Stites & Harbison, PLLC | 代理人 | Stites & Harbison, PLLC ;Haeberlin Jeffrey A.;Hayne James R. |
| 主权项 | 1. A wiring substrate comprising: a substrate body made of insulating material and having a front surface and a rear surface, the front surface and the rear surface each having a rectangular shape in a plan view and the rear surface having edges; a plurality of rear surface electrodes formed on the rear surface of the substrate body, each of the plurality of rear surface electrodes positioned adjacent to a corresponding pair of edges of the rear surface that intersect with each other, and with a part of the rear surface exposed between the plurality of rear surface electrodes and each edge of the rear surface; a frame-shaped conductive portion provided on a front surface side of the substrate body and having a rectangular frame shape in a plan view; a via conductor penetrating the substrate body and establishing electric connection between the plurality of rear surface electrodes and the frame-shaped conductive portion, and at least one projecting wiring formed on the rear surface of the substrate body between each of the plurality of rear surface electrodes and each of the corresponding pair of edges adjacent to the rear surface electrode. | ||
| 地址 | Nagoya JP | ||