| 摘要 |
The present invention uses "Chip-on-Board" (COB) metal core printed circuit board (PCB) technology in conjunc-tion with high efficiency compact imaging and non-imaging optics for LEDs to provide an emergency light that is compact, offers high performance with respect to luminance levels, long life, and low costs. Thermal impedance between the LED junction and a heat sink is significantly reduced for COB technology by placing the LED die directly on a high thermal conductivity material substrate to increase temperature dependant life and thermally dependant output power. Additionally, because there is no encapsu-lant or domed optic over the LED die, it is possible to get a much more compact and efficient substantially Etendue (area, solid angle, index squared product) preserving collection optic over the die. |
