SEMICONDUCTOR DEVICE, AND ITS MANUFACTURE, AND ADHESIVE USED THEREIN

摘要

PROBLEM TO BE SOLVED: To facilitate the sealing with resin between a semiconductor element and a wiring board by materializing highly reliable flip chip connection between the semiconductor element of a fine electrode and a wiring board easily and at low cost. SOLUTION: The bump electrode 14 of a semiconductor element 12 and the electrode 16a on a wiring board 15 are pressure-welded and connected with each other, and they are fastened by the adhesive consisting of thermosetting resin 17 arranged between the wiring board 15 and the semiconductor element 12. At that time, a conductor layer 16 to serve as wiring including the electrode 16a on the wiring board 15 is so made as to be covered by the thermosetting resin 17, and the protection and the sealing by resin of the conductor layer 16 are performed by thermosetting resin 17.