| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device, a semiconductor chip, a manufacturing method of the semiconductor device, and an electronic apparatus all of which is to realize high reliability capable of ensuring a good electrical connection state at a low cost. <P>SOLUTION: In a semiconductor device, a semiconductor chip comprises a bump 40 which has a first conductive layer 13 and a second conductive layer 15 mounted on the first conductive layer 13, and the bump is mounted on a land 21 that is laid on a wiring substrate 20 in a such state that insulating materials in which conductive particles 30 are dispersed is sandwiched in between the bump and the land. The second conductive layer 15 is formed with copper, and the thickness of which is determined as to ensure electrical connection in such a manner that the conductive particles 30 bite into the second conductive layer 15. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
