| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plane polishing device which always keeps a plane shape of a polishing pad surface highly flat, realizes a stable improvement in processing precision, and simultaneously polishes both surfaces of a semiconductor substrate such as a silicon wafer, and also to provide its processing method. <P>SOLUTION: Assuming that the upper and lower polishing pad surfaces during polishing are varied into recesses or projections owing to the polishing frictional heat, the upper and lower polishing plate surfaces are finished into opposite projections or recesses. In processing, the shape variation amount of the processing surfaces of the upper and lower polishing pads are read with a non-contact displacement meter 26 assembled in three parts of the inner periphery, center, and the outer periphery of the width of the polishing place, and the flow rate and temperature of cooling water, and the flow rate and temperature of a polishing agent to the polishing plate is controlled so that the upper and lower polishing pads maintains flat surfaces. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
