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发明名称
METHOD OF PARTIAL PLATING AND ITS APPARATUS
摘要
申请公布号
JPS5232830(A)
申请公布日期
1977.03.12
申请号
JP19750109010
申请日期
1975.09.10
申请人
OKI ELECTRIC IND CO LTD
发明人
TANAKA SEIETSU;OKUAKI YUTAKA
分类号
C25D5/02;C25D17/00
主分类号
C25D5/02
代理机构
代理人
主权项
地址
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