| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonding material reduced in stress and excellent in adhesion, curability, etc. SOLUTION: The material comprises: a reaction product obtained by reacting an epoxy compound (a) represented by the formula with a bisphenol (b) in a molar ratio [proportion of the epoxy groups in the compound (a) to the hydroxyl groups in the compound (b)] of 1-5; a compound having at least two phenolic hydroxyl groups; and an inorganic filler. The content of the reaction product is at least 30wt.% based on the whole epoxy resin. |
