SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device having an alignment mark which enables secure alignment without recognizing the sides prescribing the outward shape of the alignment mark as a slit provided in the alignment mark. SOLUTION: The alignment mark 1 formed on a semiconductor substrate has an alignment pattern 7 having a couple of recessed parts 5 prescribing the outward shape, a side having a projection part 4, and a part which is substantially parallel to the couple of sides prescribing the outward shape between the couple of sides.