发明名称 |
Method of making electronic package assembly with protective encapsulant material |
摘要 |
An electronic package assembly wherein a low profile package is soldered to an organic (e.g., epoxy resin) substrate (e.g., printed circuit board). The assembly's projecting conductive leads are soldered. An encapsulant material (e.g., polymer resin) is used to provide reinforcement for the solder-lead connections, the encapsulant material being dispensed only along opposing sides of the package's housing which do not include projecting leads (and which are oriented substantially normal to the stresses imposed on the package during operation wherein high temperatures are attained). This dispensing may follow solder reflow and solidification. The invention is particularly useful with thin, small outline package (TSOP) structures which occupy a minimum of height on the substrate surface.
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申请公布号 |
US5669137(A) |
申请公布日期 |
1997.09.23 |
申请号 |
US19950424926 |
申请日期 |
1995.04.19 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ELLERSON, JAMES VERNON;NOREIKA, RICHARD JOSEPH;VARCOE, JACK ARTHUR |
分类号 |
H05K3/28;H05K3/34;H05K13/00;(IPC1-7):H05K3/34 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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