| 摘要 |
PROBLEM TO BE SOLVED: To mount a surface-mounting electronic component to a lead frame board and make an electric circuit board compact as a result, and to ensure heat radiation. SOLUTION: The electric circuit board is provided with a lead frame 11 forming an electric circuit pattern and it is formed by resin molding using a resin 12. The lead frame is bent inside the resin 12 and it is exposed over the surface of the resin to form electrodes 11a onto which an electronic parts are mounted, and the electrodes are formed on the same surface as the resin. Thus, a cream solder necessary for surface mounting can be printed on the surface of the board, and the surface mounting of the electronic components can be realized, making the board compact. COPYRIGHT: (C)2004,JPO
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