DIE BONDING DEVICE,申请号JP19880199994-传众专利搜索

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发明名称	DIE BONDING DEVICE
摘要
申请公布号	JPH0250440(A)	申请公布日期	1990.02.20
申请号	JP19880199994	申请日期	1988.08.12
申请人	MITSUBISHI ELECTRIC CORP	发明人	MORI RYUICHIRO;OSAKA SHUICHI;BANJO TOSHINOBU
分类号	H01L21/52;H01L21/00	主分类号	H01L21/52
代理机构		代理人
主权项
地址

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