发明名称 Variable temperature semiconductor film deposition
摘要 A method of depositing a semiconductor material on a substrate. The method sequentially comprises (a) providing the semiconductor material in a depositable state such as a vapor for deposition on the substrate; (b) depositing the semiconductor material on the substrate while heating the substrate to a first temperature sufficient to cause the semiconductor material to form a first film layer having a first grain size; (c) continually depositing the semiconductor material on the substrate while cooling the substrate to a second temperature sufficient to cause the semiconductor material to form a second film layer deposited on the first film layer and having a second grain size smaller than the first grain size; and (d) raising the substrate temperature, while either continuing or not continuing to deposit semiconductor material to form a third film layer, to thereby anneal the film layers into a single layer having favorable efficiency characteristics in photovoltaic applications. A preferred semiconductor material is cadmium telluride deposited on a glass/tin oxide substrate already having thereon a film layer of cadmium sulfide.
申请公布号 US5712187(A) 申请公布日期 1998.01.27
申请号 US19950555621 申请日期 1995.11.09
申请人 MIDWEST RESEARCH INSTITUTE 发明人 LI, XIAONAN;SHELDON, PETER
分类号 H01L21/203;H01L21/363;H01L31/072;H01L31/18;(IPC1-7):H01L21/20 主分类号 H01L21/203
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