ELECTROPLATED SOLDER TERMINAL

摘要

AN PROCESS AND A STRUCTURE FOR AN IMPROVED SOLDER TERMINAL IS DISCLOSED. THE IMPROVED SOLDER TERMINAL IS MADE OF A BOTTOM METALLIC ADHESION LAYER (80), A CRCU INTERMEDIATE LAYER (85) ON TOP OF THE ADHESION LAYER, A SOLDER BONDING LAYER (90) ABOVE THE CRCU LAYER AND A SOLDER TOP LAYER (120). THE ADHESION LAYER IS EITHER TIW OR TIN. A PROCESS FOR FABRICATING AN IMPROVED TERMINAL METAL CONSISTS OF DEPOSITING AN ADHESIVE METALLIC LAYER, A LAYER OF CRCU OVER THE ADHESIVE LAYER AND A LAYER OF SOLDER BONDING MATERIAL, OVER WHICH A SOLDER LAYER IS FORMED IN SELECTIVE REGIONS AND THE UNDERLYING LAYERS ARE ETCHED USING SOLDER REGIONS AS A MASK.