| 摘要 |
<p>PURPOSE:To improve the form ability of the point terminal parts of lead plates and the solderability to a printed board by a method wherein a penetrated hole is formed at the point terminal part of each lead plate along at least the forming mold part of the point terminal part. CONSTITUTION:Penetrated holes 7, 8 and 9 are respectively bored and formed at the point terminal parts 1b, 2b and 3b of an anode lead plate 1, a cathode lead plate 2 and a gate lead plate 3 along at least the forming mold parts of the point terminal parts, in other words, including the extent of the mold parts. Accordingly, as the penetrated holes 7, 8 and 9 are each bored and formed at the point terminal parts 1b, 2b and 3b of the lead plates 1, 2 and 3 along the forming mold parts of the point terminal parts, shaping processings of curving, bending and so on at the point terminal parts 1b, 2b and 3b, in short, a forming mold becomes very easy by the existence of these penetrated holes 7, 8 and 9, and at the same time, the solderability to the point terminal parts 1b, 2b and 3b can be favorably improved.</p> |
