发明名称 |
HOUSING FOR CIRCUIT CARDS |
摘要 |
A housing for circuit cards is provided. The housing has a shell. A thermally conductive liner integral with the shell lines an interior of the shell. A protrusion of the liner extends through the shell and contacts the shell to form a pressure seal between the liner and the shell. A heat sink is disposed on an exterior surface of the shell and is thermally coupled to the protrusion of the liner. A case is disposed within the liner and is thermally coupled to the liner. The case is adapted to receive a plurality of circuit cards so that the plurality of circuit cards is thermal ly coupled to the case.
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申请公布号 |
CA2429774(A1) |
申请公布日期 |
2003.11.24 |
申请号 |
CA20032429774 |
申请日期 |
2003.05.23 |
申请人 |
ADC DSL SYSTEMS, INC. |
发明人 |
SAWYER, MICHAEL;KUSZ, MATTHEW;HAM, CHARLES G.;GUSTINE, GARY |
分类号 |
H05K5/06;H05K7/20;(IPC1-7):H05K7/14 |
主分类号 |
H05K5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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