SYSTEM ON PACKAGE

摘要

A system on package includes a first package and a second package stacked on the first package and electrically connected to one another through metal contacts. The first package includes a first printed circuit board (PCB), a system on chip which is connected to the first PCB through bumps, and a first memory device which is connected to the system on chip through micro bumps connected to vias in the system on chip. The second package includes a second PCB, a second memory device connected to the second PCB, a third memory device connected to the second PCB, and a memory controller which is connected to the second PCB and controls the third memory device.

主权项

1. A system on package (SoP), comprising:
a first package; a second package disposed on the first package so as to be stacked therewith; and electrical contacts interposed between and electrically connecting the first and second packages, wherein the first package includes: a first printed circuit board (PCB); a system on chip (SoC) having through-vias extending vertically therethrough; conductive bumps electrically connecting the SoC to the first PCB; and a first memory device having micro bumps electrically connected to the through-vias to thereby electrically connect the first memory device to the SoC, and wherein the second package includes: a second PCB of the SoP; a second memory device of the SoP electrically connected to the second PCB; a third memory device of the SoP electrically connected to the second PCB; and a memory controller which is electrically connected to the second PCB and is operatively electrically connected to the third memory device to control the third memory device.