| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method which can form a wiring conductor layer connected to a through conductor with high location accuracy and which can manufacture a wiring board excellent in connection reliability.SOLUTION: A wiring board manufacturing method comprises: forming by processing a surface of a copper foil 47 of a resin film 48, a non-through hole which does not pierce the copper foil 47 as an alignment mark 51; arranging an exposure mask 58 on a dry film 53 in a state of aligning a positioning mark 57 with respect to the alignment mark 51; performing exposure of the dry film 53 through the exposure mask 58 and subsequently performing developing to form an etching resist; and forming a wiring conductor layer by patterning by etching the copper foil 47 and removing a formation part of the alignment mark 51 by etching. |
