THERMAL DISSIPATION MODULE

摘要

A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator thermally contacts the heat source and absorbs heat generated from the heat source. The evaporator has a chamber connected to the pipe to form a loop, and the working fluid is filled in the loop. A structure of the chamber located at a connection portion between the chamber and the pipe gradually converges towards the pipe in relation to other structure of the chamber.

主权项

1. A heat dissipation module, adapted to be used in an electronic device, the electronic device having a heat source, the heat dissipation module comprising:
an evaporator, thermally contacting the heat source to absorb heat generated from the heat source, and the evaporator having a chamber; a pipe, connected to the chamber to form a loop, wherein a structure at a connection portion between the chamber and the pipe presents a profile gradually converging towards the pipe in relation to other structure of the chamber; and a working fluid, filled in the loop.