发明名称 Plasma processing apparatus
摘要 Disclosed is a plasma processing apparatus capable of more accurately controlling plasma. The plasma processing apparatus includes a shower head provided within a processing chamber, in which a substrate accommodated therein is processed, to be faced to a mounting table for mounting the substrate and supply gas from a plurality of gas discharging holes provided on a facing surface that faces the mounting table toward a substrate in a shower pattern; a plurality of exhaust holes that passes through a surface located at an opposite side to the facing surface of the shower head; a circular plate-like body that is disposed parallel to the opposite surface in a exhaust space that communicates with the exhaust holes distributed at the opposite surface and made of a conductive material; and a moving unit configured to move the plate-like body to change a distance between the exhaust holes and the plate-like body.
申请公布号 US9589771(B2) 申请公布日期 2017.03.07
申请号 US201213410994 申请日期 2012.03.02
申请人 TOKYO ELECTRON LIMITED 发明人 Hosaka Yuki;Furuya Naokazu;Ohata Mitsunori
分类号 C23F1/00;H01L21/306;H01J37/32 主分类号 C23F1/00
代理机构 Cantor Colburn LLP 代理人 Cantor Colburn LLP
主权项 1. A plasma processing apparatus, comprising: a shower head provided within a processing chamber to be faced with a mounting table for mounting a substrate and configured to supply gas from a plurality of gas discharging holes provided on a facing surface facing the mounting table toward the substrate in a shower pattern; a plurality of exhaust holes configured to pass through an opposite surface located at an opposite side to the facing surface of the shower head; a plurality of annular plate-like bodies each having no through hole and disposed above the shower head in parallel with the opposite surface of the shower head in an exhaust space communicating with the exhaust holes distributed at the opposite surface of the shower head and made of a conductive material; and a plurality of moving units configured to move the plurality of annular plate-like bodies, respectively and independently, to change a distance between each of the plurality of annular plate-like bodies and the exhaust holes such that one or more of the plurality of annular plate-like bodies become close to the exhaust holes or spaced apart from the exhaust holes, thereby suppressing or allowing a leakage status of plasma directed from a processing space provided within the processing chamber between the shower head and the mounting table toward the exhaust space provided on the opposite surface of the shower head, wherein the plurality of annular plate-like bodies each having a planar top surface and a planar lower surface are configured to be concentrically disposed at a predetermined interval with a gap inbetween in a radial direction of the shower head, and each of the plurality of annular plate-like bodies is connected to the plurality of moving units, respectively.
地址 Tokyo JP