| 摘要 |
A surface-mountable semiconductor component, comprising an optoelectronic semiconductor chip (10), a multiplicity of first contact elements (31), a multiplicity of second contact elements (32), and a moulded body (40), is specified. According to the invention, it is provided that the multiplicity of first contact elements (31) are electrically conductively connected to a first semiconductor layer (21) and the multiplicity of second contact elements (32) are electrically conductively connected to a second semiconductor layer (22) of the optoelectronic semiconductor chip (10); the moulded body (40) at least partly surrounds the optoelectronic semiconductor chip (10); the semiconductor component comprises a mounting face (50) that is formed at least in places by a surface of the moulded body (40); and the multiplicity of first and the multiplicity of second contact elements project through the moulded body in the region of the mounting face. Moreover, a method for producing the surface-mountable semiconductor component is specified. |
