| 摘要 |
An interface board (50) of a testing head (31) for a test equipment of electronic devices is described, such a testing head (31) comprising a plurality of contact probes (34), each contact probe (34) having at least one contact tip suitable to abut against contact pads of a device to be tested (35), as well as a contact element for the connection with a board (36) of the test equipment. Suitably, the interface board (50) comprises a substrate (51) and at least one redirecting die (40) housed on a first surface of that substrate (51) and a plurality of contact pins (53) projecting from a second surface of that substrate (51) opposed to the first surface, the redirecting die (40) comprising at least one semiconductor substrate (41) whereon at least a first plurality of contact pads (42A) is realized, suitable to contact a contact element of a contact probe (34) of the testing head (31), the contact pins (53) being suitable to contact the board (36). |
