| 摘要 |
A method of bonding an electrode (ELEC) of a piezoelectric ultrasonic transducer (UT) to an electrically conductive layer (ECL) of a support substrate (SS) is disclosed, in order to support the piezoelectric ultrasonic transducer (UT) and establish an electrical connection between the electrode (ELEC) and the electrically conductive layer (ECL);
the method comprising:
€¢ roughening the surface (SUR) of one or both of the electrode (ELEC) and the electrically conductive layer (ECL);
€¢ applying an adhesive (ADH) to one or both of the electrode (ELEC) and the electrically conductive layer (ECL);
€¢ assembling the electrode (ELEC) and the electrically conductive layer (ECL); and
€¢ curing the adhesive (ADH).
An ultrasonic flow meter is also disclosed. |
