发明名称 ALL-SILICON HERMETIC PACKAGE AND PROCESSING FOR NARROW, LOW-PROFILE MICROBATTERIES
摘要 A microbattery structure for hermetically sealed microbatteries is provided. In one embodiment, the microbattery structure includes a first silicon substrate containing at least one pedestal which houses a cathode material of a microbattery and at least one depression which houses A FIRST sealant material of the microbattery. The structure further includes a second silicon substrate containing at least one pedestal which houses an anode material of the microbattery and at least one depression which houses a second sealant material of the microbattery. An insulated centerpiece is bonded to the first sealant material present in at least two depressions on the first silicon substrate. An interlock structure is formed by aligning and superimposing the second silicon substrate on the first silicon substrate in a mortise and tenon fashion and sealing the two substrates using a high force.
申请公布号 US2017040580(A1) 申请公布日期 2017.02.09
申请号 US201615040706 申请日期 2016.02.10
申请人 International Business Machines Corporation 发明人 Andry Paul S.;Webb Bucknell C.;Yang Cornelia T.
分类号 H01M2/08;H01M6/40;H01M10/02;H01M2/02 主分类号 H01M2/08
代理机构 代理人
主权项 1. A microbattery structure for forming hermetically sealed microbatteries, comprising: a first silicon substrate containing at least one pedestal which defines an area that houses a cathode material and at least one depression which defines an area that houses a first sealant material; a second silicon substrate containing at least one pedestal which defines an area that houses an anode material and at least one depression which defines an area that houses a second sealant material; and an insulated centerpiece bonded to said first sealant material present in at least two depressions on said first silicon substrate, wherein an interlock structure is formed by aligning and superimposing said second silicon substrate on said first silicon substrate in a mortise and tenon fashion.
地址 Armonk NY US