发明名称 |
SEMICONDUCTOR ASSEMBLIES WITH FLEXIBLE SUBSTRATES |
摘要 |
Embodiments of semiconductor assemblies, and related integrated circuit devices and techniques, are disclosed herein. In some embodiments, a semiconductor assembly may include a flexible substrate, a polycrystalline semiconductor material, and a polycrystalline dielectric disposed between and adjacent to the flexible substrate and the polycrystalline semiconductor material. The polycrystalline semiconductor material. The polycrystalline semiconductor material may include a polycrystalline III-V material, a polycrystalline II-VI material or polycrystalline germanium. Other embodiments may be disclosed and/or claimed. |
申请公布号 |
EP3120385(A1) |
申请公布日期 |
2017.01.25 |
申请号 |
EP20140886535 |
申请日期 |
2014.03.18 |
申请人 |
Intel Corporation |
发明人 |
MUKHERJEE, Niloy;DOYLE, Brian S.;DASGUPTA, Sansaptak;RADOSAVLJEVIC, Marko;PILLARISETTY, Ravi;THEN, Han Wui;RAO, Valluri R.;CHAU, Robert S. |
分类号 |
H01L29/04;H01L21/763 |
主分类号 |
H01L29/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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