| 摘要 |
PROBLEM TO BE SOLVED: To provide an anisotropic conductive paste having sufficient adhesion strength, insulating property and moisture resistance even when the temperature upon thermal compression bonding is low (for example, at 180°C or lower).SOLUTION: The anisotropic conductive paste comprises (A) a thermoplastic resin, (B) a (meth)acrylate reactive diluent having one unsaturated double bond in one molecule, (C) a radical polymerization initiator, (D) an activator having one or more carboxyl groups in one molecule, (E) solder powder, and (F) (meth)acrylic polymer fine particles having a core-shell structure. A compounded amount of the (F) (meth)acrylic polymer fine particles having a core-shell structure is 22 pts.mass or more and 70 pts.mass or less with respect to 100 pts.mass of the (A) thermoplastic resin. |
