Filled two-component curable epoxy system with enhanced sedimentation stability

摘要

The present disclosure relates to a curable system comprising at least two compositions (A) and (B) where composition (A) comprises an epoxy resin, an inorganic thixotropic agent, an organic gelling agent and a filler and composition (B) comprises a hardener, an inorganic thixotropic agent, an organic thixotropic agent and filler. The curable system may be used in the manufacture of components or parts of electrical equipment.

主权项

1. Curable system comprising at least two compositions (A) and (B) wherein composition (A) comprises:
a-1) at least one epoxy resin, a-2) at least one inorganic thixotropic agent selected from the group consisting of fumed metal oxides and fumed semi-metal oxides, a-3) at least one organic gelling agent and a-4) at least 10 wt.-% of one or more filler, wherein the weight is based on the total weight of composition (A); and wherein composition (B) comprises: b-1) at least one hardener for epoxy resins, b-2) at least one inorganic thixotropic agent selected from the group consisting of fumed metal oxides and fumed semi-metal oxides, b-3) at least one organic thixotropic agent selected from carbamates and b-4) at least 10 wt.-% of one or more filler, wherein the weight is based on the total weight of composition (B) and wherein the viscosity of a 1:1 volume ratio mixture of compositions (A) and (B) is less than the than average viscosity of composition (A) and composition (B) as determined at 60° C. with a Rheomat equipment (type 115, MS DIN 125; D=10 s−1).