| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element mounting substrate which includes a terminal part having good bonding characteristics and has high mass productivity at low cost.SOLUTION: A semiconductor element mounting substrate comprises: a terminal part for performing wire bonding by Cu-based bonding wires; and plating layers which are formed on an end of the terminal part and include an NiP alloy plating layer, an Ni plating layer, a Pd plating layer or a Pd alloy plating layer, and a noble metal plating layer including at least one layer from an Au plating layer, an Ag plating layer, an Au alloy plating layer, and an Ag alloy plating layer or an AuAg alloy plating layer in this order from the terminal part side. |
