HEAT-BONDING DEVICE AND HEAT-BONDED-ARTICLE MANUFACTURING METHOD

摘要

Provided are a superb heat-bonding device and heat-bonded-article manufacturing method wherein, when cooling a workpiece after performing heat-bonding in a vacuum, target objects that were heat-bonded can be cooled in less time than with conventional devices and methods, without overheating the target objects. This heat-bonding device is provided with the following: a vacuum chamber (10) that contains the target objects (1) being heat-bonded and a buffer part (5); a heater (20) that heats the buffer part, which is disposed so as to contact the target objects in the vacuum chamber; a target-object temperature sensor (40) that detects the temperatures of the target objects, which are heated via the buffer part; a buffer temperature sensor (60) that detects the temperature of the buffer part; a vacuum breaker (70) that breaks the vacuum inside the vacuum chamber; and a control device (50) that activates the vacuum breaker, breaking the vacuum inside the vacuum chamber, if the difference between the temperatures detected by the target-object temperature sensor and the buffer temperature sensor falls to within a prescribed temperature-difference range.