SUBSTRATE AND METHOD FOR MANUFACTURING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a substrate that solves a defect caused by burrs of a joined member and a joining part, and a method for manufacturing the substrate.SOLUTION: A method for manufacturing a substrate 200 which has a notch part 205 at a ridge part between two adjacent faces (a joining face 201 and a cutting face 203) performs: a step of preparing a wafer substrate; a first face forming step of forming on the wafer substrate one face 201 of the two adjacent faces having the notch part of the substrate; a film forming step of forming a film 204 on the one face; and a second face forming step of forming a face 203 of the substrate other than the one face by cutting the wafer substrate after the film forming step. In the first face forming step, the one face is formed to have a recessed part, and in the second face forming step the wafer substrate is cut off in the recessed part to form the notch part.SELECTED DRAWING: Figure 1