ELECTRONIC COMPONENT, ELECTRONIC MODULE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS

摘要

An electronic component includes an electronic device, a mounting member for mounting the electronic device and having a first connecting portion electrically coupled to the electronic device and a second connecting portion, and a sealing member covering the electronic device and the first connecting portion. The mounting member includes a substrate having a mounting surface mounting the electronic device, a first conductive layer disposed on the mounting surface, and a second conductive layer. The first conductive layer includes a first conductive pattern having the first connecting portion and a second conductive pattern having the second connecting portion and spaced apart from the first conductive pattern in a second direction along the mounting surface. The second conductive pattern is connected to the first conductive pattern through a third conductive pattern included in the second conductive layer. The sealing member does not cover the second conductive pattern.

主权项

1. An electronic component comprising an electronic device, a mounting member configured to mount the electronic device and having a first connecting portion electrically coupled to the electronic device and a second connecting portion electrically coupled to outside, and a sealing member configured to cover the electronic device and the first connecting portion,
wherein the mounting member includes:
a substrate having a mounting surface mounting the electronic device,a first conductive layer disposed on the mounting surface, anda second conductive layer spaced apart from the first conductive layer in a first direction orthogonal to the mounting surface, wherein the first conductive layer includes:
a first conductive pattern having the first connecting portion, anda second conductive pattern having the second connecting portion and spaced apart from the first conductive pattern in a second direction along the mounting surface, the second conductive pattern is connected to the first conductive pattern through a third conductive pattern included in the second conductive layer, and wherein the sealing member does not cover the second conductive pattern.