CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

According to an embodiment of the present invention, provided is a chip electronic component. The chip electronic component comprises: a magnetic body including an insulating substrate; and an internal coil part formed on at least one side of the insulating substrate. The internal coil part includes: a first coil pattern formed onto the insulating substrate; a second coil pattern arranged onto the first coil pattern; and a third coil pattern arranged onto the second coil pattern. An interface part distinguished from the first to third coil patterns is arranged on at least one of an interface between the first coil pattern and the second coil pattern and an interface between the second coil pattern and the third coil pattern.