| 摘要 |
Process for producing an electronic subassembly by low-temperature pressure sintering, comprising the step of arranging an electronic component on a circuit carrier having a conductor track and connecting the electronic component to the circuit carrier by the low- temperature pressure sintering of a joining material, wherein, to avoid the oxidation of the electronic component or of the conductor track, the low-temperature pressure sintering is carried out in a gastight- closable sintering chamber (10) comprising a low-oxygen atmosphere having a relative oxygen content of 0.005 to 0.3%. The sintering operation can proceed in a virtually oxygen-free atmosphere as long as an oxygen-containing material, such as a teflon separating film (68), which contains sufficient oxygen and releases it under pressure, is present, so that a minimum oxygen concentration in the process atmosphere can be achieved directly at the sintering location by the application of pressure and temperature. After the sintering chamber (10) is closed and the low oxygen atmosphere is established, a period of time may elapse before the sintering is carried out to allow for the equilibration of materials within the chamber (10) with the low oxygen atmosphere. If the electronic subassembly is partially oxidised after the low-temperature pressure sintering, the electronic subassembly can then be sparged or evaporation-coated with a reducing agent. |
