| 摘要 |
According to an embodiment of the present invention, a chip-on-film package comprises: a support film having flexibility; a first wiring pattern disposed on the support film; a first insulating layer disposed on the support film to cover the first wiring pattern; a second wiring pattern disposed on the first insulating layer; a second insulating layer disposed on the first insulating layer to cover the second wiring pattern; and a drive element electrically connected to the first wiring pattern and the second wiring pattern. The chip-on-film package in accordance with an embodiment of the present invention further allows a large number of wirings to be disposed on the support film having a predetermined area without forming a via in the support film having flexibility. |
