LOW-TEMPERATURE PASSIVATION OF FERROELECTRIC INTEGRATED CIRCUITS FOR ENHANCED POLARIZATION PERFORMANCE

摘要

Curing of a passivation layer (60) is applied to the surface of a ferroelectric integrated circuit to enhance the polarization characteristics of ferroelectric structures (55). A passivation layer (60), such as a polyimide, is applied to the surface of the ferroelectric integrated circuit after fabrication of the active devices. The passivation layer (60) is cured by exposure to a high temperature, below the Curie temperature of ferroelectric material (62), for a short duration such as on the order of ten minutes. Variable frequency microwave energy may be used to effect such curing. The cured passivation layer (60) attains a tensile stress state, and as a result imparts a compressive stress upon the underlying ferroelectric material (62). Polarization may be further enhanced by polarizing the ferroelectric material (62) before the cure process.