Packaging methods and packaged semiconductor devices

摘要

Packaging methods and packaged semiconductor devices are disclosed. In one embodiment, a packaging method includes providing a first die, partially packaging the first die, and forming a plurality of solder balls on a surface of the partially packaged first die. An epoxy flux is disposed over the plurality of solder balls. A second die is provided, and the second die is partially packaged. The plurality of solder balls is coupled to the partially packaged second die.

主权项

1. A packaged semiconductor device comprising:
a first die coupled to a first substrate; a second die coupled to a second substrate; a plurality of solder joints coupled between the first substrate and the second substrate; an epoxy layer coupled to each of the plurality of solder joints; and an underfill material disposed between the first substrate, the second substrate, and the epoxy layer coupled to the plurality of solder joints, the underfill material having a different material composition than the epoxy layer, the underfill material surrounding the epoxy layer coupled to the plurality of solder joints and being between adjacent solder joints of the plurality of solder joints; wherein the plurality of solder joints includes a metal stud; and wherein at least one of the plurality of solder joints contacts a first contact pad and a second contact pad on the first substrate and the second substrate, respectively, the metal stud of the at least one of the plurality of solder joints contacting the first contact pad but not contacting the second contact pad, at least a portion of the metal stud being exposed through a solder material of the at least one of the plurality of solder joints.