| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module which reduces thermal stress associated with thinning of a power semiconductor element and achieve excellent long-term reliability.SOLUTION: A power module comprises: power semiconductor elements 21, 21 arranged on an insulating substrate 11; and a lead frame 61 in which embossed parts 613, 614 connected to surface electrodes of the power semiconductor elements 21, 22 are formed to have a board thickness thinner than that of an electrode part 610 and project on the surface electrode side. As a result, rigidity of the embossed parts 613, 614 can be reduced and thermal stress at solder bonded parts 30, 31 is suppressed.SELECTED DRAWING: Figure 2 |
