| 摘要 |
PROBLEM TO BE SOLVED: To suppress increase in size of a whole device and increase in production cost with sharing a replacement suction nozzle.SOLUTION: An electronic component mounting device 1 for mounting electronic components on substrates B comprises: a plurality of substrate transfer parts 3F, 3R where substrate transfer lines for transferring the substrates B are arranged in parallel with each other; a plurality of mounting heads 5F, 5R which hold suction nozzles N for holding the electronic components by suction detachably and which are provided in a movable fashion so as to mount electronic components held by the suction nozzles N by suction on the substrate of the substrate transfer parts 3F, 3R; and a nozzle exchange part 7 which is provided between the substrate transfer parts 3F, 3R and on which multiple types of replacement suction nozzles N capable of holding different types of electronic components by suction respectively are placed. |
