Thermal architecture

摘要

The described embodiment relates generally to the field of thermal management. More specifically an apparatus for cooling a unibody computing device with obscured inlet and outlet vents is disclosed. Inlet vents are arranged on a bottom surface of the unibody computing device and then exhaust air is vented out from a rear surface of the computing device. The rear vents can be obscured by a stand designed to support the weight of the computing device. By venting exhaust air to either side of the support stand exhaust air can be prevented from being drawn back into the inlet vents, thereby avoiding an overheating condition.

主权项

1. A computing device including a heat rejection subsystem for the computing device and a unibody enclosure having an interior surface that defines a cavity suitable for accommodating plurality of electronic components, the computing device comprising:
a stand rotatably coupled with the unibody enclosure at a coupling point located on a rear exterior surface of the unibody enclosure; an inlet vent arranged along a lower edge of the unibody enclosure, the inlet vent allowing air into the cavity to cool the plurality of electronic components; an outlet vent arranged along the rear exterior surface, wherein the outlet vent is concealed by the stand, and wherein the outlet vent directs the air exiting the unibody enclosure in a direction substantially parallel to the rear exterior surface and away from the stand; and a fin stack disposed within the outlet vent, the fin stack having curved fins that divert the air exiting the unibody enclosure to extend around the stand, wherein the fin stack is connected to a plurality of heat pipes responsible for transferring heat from a plurality of integrated circuits disposed within the unibody enclosure to the fin stack.