发明名称 COPPER-CLAD LAMINATE AND FLEXIBLE PRINTED WIRING BOARD USING COPPER-CLAD LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide an FPC which maintains excellent bondability between a resin film and copper foil and has a high degree of freedom in arrangement relation between the resin film and a positioning marker with excellent transmissive visibility at a resin film portion remaining after removal of the copper foil by chemical etching, and a copper-clad laminate for obtaining the FPC.SOLUTION: The copper-clad laminate includes a resin film and copper foil which are directly laminated. The peel strength between the resin film and the copper foil is 0.5 N/mm or more. The resin film remaining after removal of a part of the copper foil by chemical etching has a transmissive visibility Vdefined by a formula: V=(T-T)×C/100 (T: total light transmittance (unit: %), T: diffuse transmittance (unit: %), and C: transparency (unit: %)) satisfying: V≥10%.
申请公布号 JP2016007722(A) 申请公布日期 2016.01.18
申请号 JP20140127997 申请日期 2014.06.23
申请人 SH COPPER PRODUCTS CORP 发明人 MUROGA TAKEMI;GOTO CHIZURU
分类号 B32B15/08;C25D7/06;H05K1/09;H05K3/06;H05K3/38 主分类号 B32B15/08
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