DEVICES FOR METHODOLOGIES RELATED TO WAFER CARRIERS

摘要

Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed.

主权项

1. An apparatus to separate a semiconductor wafer from a disk, the apparatus comprising:
a bonded assembly including a semiconductor wafer, an adhesive layer, and an optically transparent disk dimensioned to receive the semiconductor wafer and bonded to the semiconductor wafer by the adhesive layer to provide support for the semiconductor wafer, the optically transparent defining a circular perimeter with first and second corner profiles, at least one of the first and second corner profiles having a chamfered profile to reduce likelihood of chipping; and a debonding chuck including a first surface that defines a recess, a second surface disposed in the recess and separated from the first surface to define a depth of the recess, the second surface defining at least one suction opening configured to facilitate delivery of a suction force to the semiconductor wafer via the recess, and a side wall that joins the first and second surfaces, the side wall defining at least one opening dimensioned to limit a pressure different between the recess and outside of the recess during the application of the suction force.