DIE ATTACHMENT, DIE STACKING, AND WIRE EMBEDDING USING FILM

摘要

Systems, methods, and/or devices that facilitate stacking dies in a multi-die stack using film over wire and attaching a die to a substrate are presented. Film over wire (FOW) techniques can be employed to facilitate stacking dies that are the same or similar in size such that the wires bonded onto the lower die can be embedded in film used to attach the two dies. FOW techniques can also be employed to embed a smaller die and wires attached thereto in film underneath a larger die stacked on top of the lower die such that the larger die can be supported by the film in areas where the larger die would otherwise overhang. Die attach film can be utilized to facilitate attaching a die to a substrate such that all areas between the die and substrate are filled thereby reducing or eliminating delamination.