| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the electrical connection properties of a salient electrode provided in a semiconductor device. <P>SOLUTION: A first part 22 in wiring 20 positioned on an upper surface 21 in a resin projection 18 of the semiconductor device includes a projection 28 where its planar shape expands outside, and its connection area can be made wider than that of a case without including any projections 28, thus providing the semiconductor device 1 where electrical connection properties have been improved. The planar shape allows a sufficient connection area to be secured as compared with a rectangular shape, thus suppressing a decrease in the connection area with an opposing wiring pattern owing to a change with time in an adhesive, and hence providing an electronic device where electrical connection properties have been improved. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
