发明名称 |
Interposer-on-glass package structures |
摘要 |
A device includes an interposer including a substrate, and a first through-substrate via (TSV) penetrating through the substrate. A glass substrate is bonded to the interposer through a fusion bonding. The glass substrate includes a second TSV therein and electrically coupled to the first TSV.
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申请公布号 |
US8411459(B2) |
申请公布日期 |
2013.04.02 |
申请号 |
US20100834943 |
申请日期 |
2010.07.13 |
申请人 |
YU CHEN-HUA;LIN JING-CHENG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD |
发明人 |
YU CHEN-HUA;LIN JING-CHENG |
分类号 |
H05K7/00;H05K1/16 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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