发明名称 RESIN SEALING METHOD AND RESIN SEALING DEVICE
摘要 PROBLEM TO BE SOLVED: To enable a film to be closely attached to a surface of a mold thereby efficiently preventing the occurence of breakage and wrinkles of the film.SOLUTION: A resin sealing method includes the steps of: supplying a mold releasing film 5 to a mold for resin sealing 1; preheating the supplied mold releasing film 5; and suctioning and coating the supplied mold releasing film 5 along a surface of the mold 1 in a heating state.
申请公布号 JP2013232482(A) 申请公布日期 2013.11.14
申请号 JP20120103088 申请日期 2012.04.27
申请人 TOWA CORP 发明人 HIRATA YUSUKE;KAWAKUBO KAZUTERU;TOKUYAMA HIDEKI
分类号 H01L21/56 主分类号 H01L21/56
代理机构 代理人
主权项
地址