发明名称 VACUUM SUCTION ARM FOR SUBSTRATE TRANSPORTATION
摘要 PROBLEM TO BE SOLVED: To sufficiently support both a warped substrate and a non-warped substrate while vacuum-sucking them, and to also sufficiently support a substrate in which irreversible warpage such as thermal deformation occurs.SOLUTION: Top faces of two branch parts 2 which are provided while being branched from a distal end of a tabular and long base part 1, are flush with a top face of the base part 1, and the branch parts 2 are narrower than the base part 1. On the top face of the base part 1, a circumferential suction hole 11 and a central suction hole 14 are formed and on the top face of each of the branch parts 2, a rubber member 3 is provided and protrudes upward. Regardless of whether warpage occurs, a substrate S is supported at three points in contact with the rubber members 3 while being sucked in the suction holes 11 and 14.
申请公布号 JP2015201540(A) 申请公布日期 2015.11.12
申请号 JP20140079194 申请日期 2014.04.08
申请人 USHIO INC 发明人 MANYA AKINOBU
分类号 H01L21/677;B25J15/06;B65G49/06;B65G49/07 主分类号 H01L21/677
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